The concept of wearable devices has become a hit in recent years. Not only can such portable devices be used as hardware, but they can also enable powerful features through software support, data interactions, and cloud interactions. Getting smaller and smaller, they have transformed from a very unrealistic concept into a part of our daily life. They have unknowingly become "embedded" into the basic necessities of our life.
Even the 2022 Winter Olympics that concluded a few days ago employed "wearable motion sensors" to collect a lot of basic data from short-track speed skaters. The application potentials of smart wearable devices are really limitless.
Recently, FORESEE, Longsys's industrial storage brand, has followed the market trends and launched ePOP3, a "favorite of the embedded fashion", to jointly promote the deep integration of the intellectualization and application market from the "source" with industry customers.
Cutting-edge Performance and Design
Integrating eMMC and LPDDR into the same package, ePOP3 now features two mainstream capacity combinations of 8GB plus 8Gb and 8GB plus 4Gb, in a maximum thickness of 0.9mm. Coupled with a low-power consumption mode, which can reduce the power consumption by up to 30% than that of the normal mode, it is able to effectively improve the battery life of terminal devices. Using high-performance flash memory chips, the NAND Flash boasts a DRAM speed up to 1600Mbps. It gives full play to the synergistic effect when the performance, durability, and stability are perfectly balanced.
Born for Smart Wearable Devices
ePOP3 can care for the data storing and caching needs of devices and harness highly integrated equipment. It is particularly suited for smart wearables, educational electronics, and other terminal applications that have higher requirements for miniaturization and low-power consumption.
40% to 60% PCB space can be saved on terminal devices
Terminal manufacturers need to improve the level and quality of raw materials and maximize the space utilization of each PCB when users have increasingly high requirements on the appearance, volume, weight, and performance of intelligent equipment. Utilizing the “two-in-one” packaging technology to integrate RAM and ROM, the ePOP3 can be mounted on the top of the CPU of a compatible host. The circuit design of the PCB is also optimized to dramatically save the internal space of intelligent terminals featuring multitasking capabilities.
The list of purchase materials is optimized for end customers
Leveraging the Thin Profile Fine-Pitch Ball Grid Array (TFBGA) stack packaging technology, ePOP3 can free customers from the burden of purchasing both embedded multimedia chips and dynamic random access memory (DRAM), which can simplify the supply chain of components, make the supply cycle controllable, and reduce the cost.
Premium resources are selected to ensure long-term stable quality and supply
From acceptance to finished products, all particles of FORESEE ePOP3 will undergo the validation of Longsys's comprehensive quality management system. Besides, the stocking and backup operations are strengthened by management in every step of the process, from client requirements, product development, and material selection to production and delivery, to ensure long-term stable supply needs.
1. Compared with conventional TLC Flash, the Flash used in ePOP3 is characterized by a longer service life and a higher stability.
2. The DRAM is crafted with the brand new 20nm process, further improving the performance while still controlling the cost.
A comprehensive software and hardware testing solution is in place to significantly boost the quality
FORESEE ePOP3 has adopted the SLT chip testing solution developed by Longsys, innovatively enabled high-frequency simultaneous large-scale testing of eMMC (FT, RDT) and LPDDR, created a station for automatic batch testing, and independently developed the testing programs. The product quality is ensured when 256 or even more chips can be tested simultaneously, while also enabling the eMMC test, DRAM speed test, functional test, power consumption test, and other testing capabilities within the same products.
(Test Automation Station)
Longsys's embedded storage product line has gained a great wealth of experience in smart wearables, IoT, smartphones, and other application domains since its establishment 11 years ago. It now has the ability to deliver products that meet the various requirements of customers. Smart wearable devices will become an important node for artificial intelligence (AI) when AI, virtual reality (VR), augmented reality (AR), and other technologies are mature and widespread. This year, Longsys's embedded storage product line will continue to upgrade and expand the specifications and selections of existing products, including ePOP4x, eMMC, eMCP, UFS, and other featured products, to introduce more capacity and performance combinations to fully cover intelligent terminal applications and provide customers with diversified choices.
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