Smart wearable is a key area with its huge market potential in the 5G era. As the Internet of Things era approaches, the wearable device market is expected to see a quantum leap. Users will have more demands for wearable devices: thinner and lighter designs, higher performance, larger capacity, and lower power consumption are the development trend of smart wearable devices.
The "Quarterly Report on China Wearable Device Market in the Third Quarter of 2019” released by IDC China, a global authoritative market research organization, shows that the total shipment of wearable devices in China in Q3 2019 reached 27.15 million units, a year-on-year increase of 45.2%. By 2023, China’s wearables market shipments will approach 200 million.
In response to the fast-growing wearables market, FORESEE, an embedded storage brand under Longsys, released a new ePOP product (embedded Package On Package) at this CES.
FORESEE ePOP integrates LPDDR3 and eMMC in a compact package. The standard size is 10.0mm X 10.0mm X 0.9mm, thinner than similar products on the market. With capacity of up to 32GB, eMMC is suitable for systems with limited space such as wearables, meeting the market’s requirements for high performance, low energy consumption, and thinness.
Protocol: eMMC 5.1+LPDDR3
Flash：3D NAND Flash
Size: 10.0mm X 10.0mm X 0.9mm
FORESEE ePOP’s unique pSLC model guarantees the product stability. Equipped with the latest SOC platform, it can fully support eMMC5.1 protocol (HS400). The 3D NAND flash greatly improves the product performance and brings a smooth use experience.
At this CES, FORESEE also released another new product uMCP, which adopts an ultra-fast Universal Flash Storage (UFS) controller to offer a highly integrated, high-performance storage solution for smartphones.
uMCP is a UFS-based multi-chip package that combines LPDDR4x, NAND flash, and UFS controllers. It occupies less memory space to support more flexible, high-performance system design.